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Hubbell HYC26C26 Grounding and Bonding, C-Tap, DB, #10AWG, 10, Index 0, 5-Pack

SKU: HYC26C26 Hubbell Premise Wiring

Special Order: typically 2–6 weeks

Ships directly from the manufacturer. This is an estimated lead time, not a guaranteed delivery date.

Availability can change and lead times may be longer. If your project has a deadline, check with us before ordering.

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Key Features

  • Ensures permanent, low-resistance electrical bonds for reliable grounding and bonding in security and networking installs
  • Die index verification reduces rework by confirming the correct crimp die was used for consistent connections
  • Copper construction resists corrosion to maintain conductivity over time in surveillance and monitoring systems
  • Compact compression design supports tight spaces and clean terminations on #10 AWG conductors
  • 5-pack supply reduces jobsite downtime and ensures spare taps for multi-point grounding applications

Quick Specifications

Product Model
HYC26C26
Brand Name
Hubbell Premise Wiring
Product Name
Grounding and Bonding, C-Tap, DB, #10MPAWG,10MP, Index0MP,5MPPack
Product Type
Compression C-Tap
View Full Technical Specifications

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Product information

HYC26C26

Overview

Deliver dependable grounding and bonding where system uptime matters. The Hubbell Premise Wiring HYC26C26 compression C-Tap provides irreversible, low-resistance copper connections that protect power and ground paths for security, surveillance, monitoring and networking equipment. Designed for #10 AWG conductors and supplied in a practical 5-pack, these compression C-Taps include a die index to verify the correct crimp die was used — minimizing rework and ensuring consistent, code-compliant terminations. Copper material offers superior conductivity and corrosion resistance for long-term performance at camera mounts, access control panels, server rooms and protection grounds. The compact, easy-to-install design fits tight spaces and speeds installation for contractors, integrators, and facility teams. For critical low-voltage and IT power applications, choose HYC26C26 C-Taps to standardize grounding practices and reduce troubleshooting. Order this Hubbell Premise Wiring solution today to streamline installations and secure reliable grounding on every project.

Features

  • Ensures permanent, low-resistance electrical bonds for reliable grounding and bonding in security and networking installs
  • Die index verification reduces rework by confirming the correct crimp die was used for consistent connections
  • Copper construction resists corrosion to maintain conductivity over time in surveillance and monitoring systems
  • Compact compression design supports tight spaces and clean terminations on #10 AWG conductors
  • 5-pack supply reduces jobsite downtime and ensures spare taps for multi-point grounding applications
7 of 7 specifications
Technical specifications for Hubbell HYC26C26 Grounding and Bonding, C-Tap, DB, #10AWG, 10, Index 0, 5-Pack
General Information
Brand Name Hubbell Premise Wiring
Manufacturer Hubbell
Product Name Grounding and Bonding, C-Tap, DB, #10MPAWG,10MP, Index0MP,5MPPack
Product Type Compression C-Tap
Manufacturer Part Number HYC26C26
Technical Information
Material Copper
Physical Characteristics
Height 1.35"

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SKU:
HYC26C26
Manufacturer part:
HYC26C26
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What should I know about returns?

Returns require an approved RMA. Consult the linked return policy for deadlines and eligibility. For standard non-defective returns, eligible factory-sealed items carry a 15% restocking fee and customer-paid return shipping; open-box and used items are refused. Defective and DOA claims follow the policy's separate terms. Special orders and other exclusions are final sale.

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Hubbell HYC26C26 Grounding and Bonding, C-Tap, DB, #10AWG, 10, Index 0, 5-Pack

HYC26C26

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