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Hubbell HYC4C4 Grounding and Bonding, C-Tap, DB, #4AWG, 4, Index Beige, 10-Pack

Special Order: typically 2–6 weeks

Ships directly from the manufacturer. This is an estimated lead time, not a guaranteed delivery date.

Availability can change and lead times may be longer. If your project has a deadline, check with us before ordering.

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Key Features

  • Ensures consistent, code-compliant crimps: die index verifies the correct die for every #4 AWG compression, reducing rework on-site.
  • Creates an irreversible, low-resistance bond for reliable grounding and bonding in security, surveillance and network power systems.
  • Solid copper construction resists corrosion and maintains conductivity for long-term electrical continuity.
  • 10-pack supply improves jobsite efficiency—ideal for multi-point grounding runs, panels and backbone installations.
  • Index beige color enables quick identification and inventory control during installations and maintenance.

Quick Specifications

Product Model
HYC4C4
Brand Name
Hubbell Premise Wiring
Product Name
Grounding and Bonding, C-Tap, DB, #4MPAWG,4MP, Beige,10MPPack
Product Type
Compression C-Tap
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Product information

HYC4C4

Overview

Deliver dependable grounding and bonding for security, surveillance and low-voltage networking systems with the Hubbell Premise Wiring HYC4C4 compression C-Tap. Designed for #4 AWG conductors, this compression C-Tap provides an irreversible, low-resistance connection that preserves electrical continuity for grounding, monitoring and power distribution. The die index feature confirms the correct crimp die was used, lowering the risk of improper crimps and saving technician time on inspections. Constructed from solid copper, the device resists corrosion and ensures stable conductivity in critical security and IT environments. Supplied in a convenient 10-pack and finished in index beige for easy identification, the HYC4C4 is optimized for panel bonding, equipment grounding and multi-point tap applications. Use these compression taps to simplify installations, improve reliability of surveillance camera power grounds, and meet grounding best practices across networking racks and enclosures. Order the Hubbell HYC4C4 C-Tap to streamline installs and protect your critical systems with a durable, code-minded grounding solution.

Features

  • Ensures consistent, code-compliant crimps: die index verifies the correct die for every #4 AWG compression, reducing rework on-site.
  • Creates an irreversible, low-resistance bond for reliable grounding and bonding in security, surveillance and network power systems.
  • Solid copper construction resists corrosion and maintains conductivity for long-term electrical continuity.
  • 10-pack supply improves jobsite efficiency—ideal for multi-point grounding runs, panels and backbone installations.
  • Index beige color enables quick identification and inventory control during installations and maintenance.
8 of 8 specifications
Technical specifications for Hubbell HYC4C4 Grounding and Bonding, C-Tap, DB, #4AWG, 4, Index Beige, 10-Pack
General Information
Brand Name Hubbell Premise Wiring
Manufacturer Hubbell
Product Name Grounding and Bonding, C-Tap, DB, #4MPAWG,4MP, Beige,10MPPack
Product Type Compression C-Tap
Product Series Grounding and Bonding
Manufacturer Part Number HYC4C4
Physical Characteristics
Height 0.81"
Material Copper

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SKU:
HYC4C4
Manufacturer part:
HYC4C4
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Availability is shown above. Special-order items and project quantities may need additional lead time. Contact us to confirm a delivery date before scheduling installation.

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What should I know about returns?

Returns require an approved RMA. Consult the linked return policy for deadlines and eligibility. For standard non-defective returns, eligible factory-sealed items carry a 15% restocking fee and customer-paid return shipping; open-box and used items are refused. Defective and DOA claims follow the policy's separate terms. Special orders and other exclusions are final sale.

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Hubbell HYC4C4 Grounding and Bonding, C-Tap, DB, #4AWG, 4, Index Beige, 10-Pack

HYC4C4

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